On July 25th, 2005, Secretary General Jing Wang met Mr. Donald M. Boles. InterDigital is a board member of TD-SCDMA Forum. Mr. Boles is a Senior Vice President and Chief Patent Strategist of InterDigital Communications Corporation. The two parties exchanged opinions and ideas in the latest TD-SCDMA development. Mr. Boles provided update of InterDigital’s R&D projects in TDD technologies. Discussions were conducted on various topics such as future development path of the TD-SCDMA Forum and it’s services, 3G IPR negotiation and granting of 3G licenses, etc.

According to Mr. Boles, the focus of InterDigital is on the R&D of forward-looking technologies. There are altogether about 350 technical personnel in InterDigital. InterDigital has a lot of IPRs in all the there 3G standards and has acquired at least 50 patent families in both TDD and FDD. These IPRs are mainly about air interface, interoperability, high speed and low power consumption design solutions, etc. Currently, the main revenue stream of InterDigital comes from its IPR income. Its annual IPR income exceeds 100 millions US dollars. This still does not include the pending IPRs. InterDigital has signed the IPR license agreement with many big name companies, like Nokia, Infineon, NEC, Sharp, Panasonic and other Japanese wireless equipment manufacturers. Mr. Boles showed great interest in the Chinese 3G IPR negotiation and expressed his willingness to be involved into this negotiation on behalf of InterDigital. InterDigital initiated its research on TDD technology from very early. In year 1999, it reached an agreement with Nokia on joint development of TDD technology. In addition, InterDigital has very strong presence in both HSDPA and HSUPA. This will benefit the future evolution of TDD.

Secretary General Wang introduced to Mr. Donald M. Boles the plan of the Forum. He said the forum will dedicate to promote the understanding of TD-SCDMA in the world and will serve the members better. InterDigital is a board member of the forum and has its own strength in TDD. He stated that the forum will provide high quality service to InterDigital and suggested that InterDigital be more involved into the R&D of TD-SCDMA. He said the forum will further facilitate the communication between InterDigital as well as other board and senior members of the forum and the government and different players in the industry chain. The image and visibility of these members will therefore be leveraged through these activities.